Department of Semiconductor Systems Engineering | Sejong University
AFG31022
- DC Voltage: -5 V ~ 5 V
- Pulse frequency range: 1 mHz ~ 20 MHz
- Pulse width: 16 ns ~ 999.99 s
- Number of channels: 2
- Standard waveforms: Sine, Square, Pulse, Ramp, etc
SourceMeter 2635B
Voltage: 200 mV ~ 200 V
- Current: 1 nA ~ 1.5 A
- Pulse width: 200 us ~
- Pulse on & off level: 10 & 90 % of set pulse level
RTA-System
- Temperature range : R.T. ~ 1,000 ℃
- Temp. Over shoot: < 5.0 ℃
- Temp. Uniformity : < ± 1 %
- Ultimate Vacuum Pressure: Less than 5 x 10⁻³ Torr
- Single wafer processing with Loading unit
- Chamber Quartz Size : Φ 70 mm x 600 mm (L)
- Side Flange Size : Φ 120mm x 20mm (t), 2 set
- Ambient : Vac, Ar, O2, N2
Olympus microscope
- Eyepiece: WHN 10x / 22mm FOV
- Objectives: 5x, 10x, 20x, 50x
- Condenser: 1.1 N.A.
- Reflected Light: 6 Position Reflected Light Illuminator
- Light Source: Halogen
UV-Visible spectrophotometer
- Wavelength: 190 ~ 1100 nm
- Slit width : 1 nm
- Photometric noise: < 0.0002 A
Wet station
- Spin coater
- Hot plate
- Chemical drain
Mask aligner
- Substrate Size : Piece~6”
- Exposure Mode : Soft, Hard Contact , Vacuum Contact
- Exposure Optics : I, G, H-line
- Alignment : Top Side Alignment
Thermal & plasma enhanced ALD
- Film Uniformity: Al₂O₃ ± 1% on the 200 x 200 mm² square substrate
- Base Pressure: < 5.0 x 10⁻³ [Torr]
- Number of MFC: Carrier & purge gas / 3EA & 2nd reactant gas / 2EA
- Materials: Al₂O₃, ZrO₂, HfO₂, HfZrOx
RF/DC Co-Sputtering System
- Load Lock Type Sputtering system
- Substrate Heater Temp: ~ 400 ℃ (Max. 500 ℃)
- Gun Power Supply : RF 1 set, DC 1 set
- Process Gas : Ar, O₂, N₂
- Base Pressure : 5.0 x 10⁻⁶ torr
Multi-Purpose High Speed Centrifuges
- Max RPM: 12000 rpm
- Max RCF: 15520 g
- RCF/RPM conversion
- Program memory: 100
MIST CVD
- Sequential MIST generation
- Temp: ~ 1000 °C
- Materials for Epitaxy: Gallium oxide, aluminum oxide, iridium oxide and other oxide materials
SourceMeter (High voltage)
- Voltage: ~1100 V
- Current: ~1.00 A
- 0.012% basic measure accuracy with 6.5 digit resolution, 1700 readings/second at 4.5 digits via GPIB
Keithley 4200A-SCS Parameter Analyser
- DC Current-Voltage (I-V): 0.2 µV ~ 210 V,10 aA ~ 1A
- Capacitance-Voltage (C-V): 1 kHz - 10 MHz, ± 30V DC bias
- 1 kHz frequency resolution (1 kHz~10 MHz)
- Pulsed I-V: ±40 V (80 V p-p), ±800 mA, 200 MSa/sec, 5 ns sampling rate
Plasma Cleaner
ㅤ
E-beam Evaporator
- Base pressure: 1 x 10⁻⁶ Torr
- Source: 1 theraml boat, 3 e-beam crucible
- Sub. Heat: ~650 °C
- Cooling sub.: for polymer films
- Materials: Pt, Au, Ag, Ti, Al, Cr
Newport Photo Power Meter
- Optical power meter
- Model: Economical Handheld Laser Power Meter, 843-R
- Measurement Power: pJ, pW ~thousands of Watts
Hume Hood
- Spin coater
- Hot plate x 2
- Mentle
UV/Ozone treatmen system
- Wavelength: 185, 254nm
- Size: up to 8" wafer
Facing Targets Sputtering System (FTS)
- Base pressure : 1 x 10⁻⁶ Torr
- Source : DC power
- Targets : 2" Ti, Mo, W, Ag, ITO, IGZO
I-V/C-V Probe station
- Measurement: I-V, C-V
- Hot chuck : R.T. - 300 °C
- 4 manipulators
Hall effect measurement system
- Measurement Temperature : 300K, 77K (Liquid Nitrogen)
- Sample Size : Max. 6mm × 6mm